bga

常见例句

Fitting option BGA nozzle ensures excellent result and efficient.
选购专用BGA风咀,使拆焊效果更佳及操作更快捷。
Desirable for high-performance Ball Grid Array (BGA) package.
高性能球形焊点阵列封装需要倒装焊。
This method meets the needs of the on-line test of BGA coplanarity.
该测量方法可以满足BGA(球脚阵列)封装引脚尺寸的实时在线检测的需要。
BGA measurement is measured for inside solder point.
BGA量测以最内侧焊点为量测依据。
This procdure provides instruction for lead free BGA reballing process.
该程序为无铅。
SMT maintain, BGA chip rework, the good solderability, the low smog.
SMT维修、BGA芯片焊接与植球，活性强，低烟雾。